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Soldering Materials

Solder Preforms (SP)

Solder paste with lead-free alloys

Long stencil life
Excellent wetting properties
Various metal particle sizes
Typical SAC alloys
Alloys for low-temperature applications

ALPHA Accuflux solder preforms

Available in many sizes and thicknesses
Enables fast pick and place assembly
Adhesive-free flux suitable for vacuum placement systems
Available in standard alloys, as well as Innolot and lead-containing alloys
Tape & reel packaging

ALPHA Exactalloy tape & reel solder preforms

Selective solder volume expansion to increase solder joint strength
Allows 100% hole filling
Reduces flux residues for ICT
Saves rework and inspection after the reflow process
Suitable for low temperatures

High silver content bar solder

High silver content, lead-free alloys for wave and selective soldering applications
Excellent yield that outperforms all Sn/Cu-based materials
Fast wetting for excellent solderability
Lower level of bridging compared to Sn/Cu alloys
High mechanical reliability
Excellent performance with a wide range of fluxing technologies

Solder pastes with lead-containing alloy

Very good workability for lead-containing applications
Long stencil service life
Very good wetting properties
Various metal grain sizes
Lead-containing alloys

Dispensable solder paste / Solder paste for jet systems

Very good processability
Excellent wetting properties
Various metal particle sizes
Typical SAC alloys
Alloys for low-temperature applications
Lead and lead-free alloys

ALPHA Cut Standard

Framed or frameless stainless steel materials for all commercially available printers and formats
Cut-outs for ultra-fine pitch applications
Highest positioning accuracy

ALPHA Tetrabond

Durable – Rigid frame reduces the risk of damage from stencil handling
Space-saving – Store up to 5 times as many ALPHA Tetrabond foils compared to a conventional framed stencil
Safe handling, no sharp edges
Excellent stencil rigidity
Easy operation, with or without charging station

ALPHA tensoRED

Reduced maintenance effort
Improved handling and reliability
Compatible with Tetra Bond and Vector Guard

Low silver content bar solder

Lead-Free Alloys
Lower material costs compared to SAC305
Fast wetting and wide process window
Low dross formation
Low copper dissolution (low copper leaching)