Solder paste with lead-containing alloy

  • Excellent processability for lead-containing applications
  • Long stencil life
  • Excellent wetting properties
  • Various metal particle sizes
  • Lead-containing alloys
Datasheet - OM-5100 PDF herunterladen →
Datasheet - OM-5300 PDF herunterladen →

Solder paste OM-5100 and OM-5300

The Alpha solder paste OM-5100 and OM-5300 are specially designed for lead-containing applications – qualified according to ROL0 IPC J-STD 004A.

The solder paste are available in grain sizes T3 and T4, as well as in the alloys tin-lead (SnPb) and tin-lead-silver (SnPbAg).

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