Various processes are used as an alternative to HAL.
The most common processes are electroless tin and electroless silver, in which a fine layer of tin up to 1 μm is applied. In contrast to the HAL process, the surfaces are more even.
Another variant for protecting copper surfaces is OSP (Organic Surface Preservative). Here, lower layer thicknesses are produced than with electroless tin or silver.
In addition to the systems, we also offer accessories such as filter systems and consumables.
The filter systems include centrifuges, belt filters, tower filters for 10‘, 20’ and 30’ filter cartridges or bag filters.
The following consumables are available:
Consulting – Project Planning – Hardware and Software Development – System Integration – Training – Installation – Process Support – Service Hotline – Maintenance – Service – Spare Parts – Documentation
Gratis Beratung anfordern
Unsere Spezialisten stehen Ihnen gerne bei Beratungen zu den verschiedenen Fertigungsprozessen oder komplette Linienlösungen zur Seite.
