| Product brochure - solder preforms | PDF herunterladen → |
ALPHA Exactalloy preforms offer improved solder volume for a reliable solder joint, reduced flux residue for improved electrical reliability and a reduction in voids under the thermal pads of components.
Thanks to the practical tape & reel packaging, high placement rates can be achieved in standard SMT processes.
The product is available in sizes 1406 to 0201.
Intrusive reflow is often used for the assembly of through-hole components in an SMT process. However, solder paste alone often cannot create sufficient solder volume to achieve 100% hole fill. By placing an Alpha Exactalloy solder preform in the solder paste opening surrounding the pin and hole, 100% hole fill is achieved every time.
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