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Surface Finish

Vertical HAL – QS Blue

Better soldering quality
Quick air knife change
Less maintenance
5 degree air knife angle for optimum performance
Longer service life

Horizontal HAL

Significant cost reductions in chemistry, solder and labour
Increased capacity – typical throughput of 2000 boards per shift
Increased uptime Production availability in all 3 shifts
Less error-prone due to improved quality and technology, among other things
Convection preheating reduces thermal shock and flux pick-up
Reduced environmental impact

Single-sided tinning – roller tinner

Maximum panel width 610 mm
Free-standing rigid steel frame enclosed in easy-to-clean polyester resin base unit
Integrated control cabinet offers start/stop, variable roller speed and temperature control
Soldering temperatures of up to 300 °C possible
Fast heat-up time along with a quick and accurate response to changes in soldering temperature

Electroless tin / electroless silver / OSP

Better homogeneity of the surface structure
Guarantee of consistent solderability of the printed circuit board