| Datasheet - CVP-390 | PDF herunterladen → |
| Datasheet - JP-500 | PDF herunterladen → |
| Datasheet - JP-501 | PDF herunterladen → |
Alpha solder paste for the dispensing application process
Lead-free and lead-containing solder paste for use in the automatic dispensing process, can also be used for the manual rework process, such as CVP-390.
Typical filling in syringe cartridge form is 30 ccm and a typical content of 40 g.
The solder paste is available in various flux systems, viscosities and alloys.
ALPHA JP-500 is formulated to deliver excellent visual joint cosmetics and is rated ROL0 per IPC J-STD-004. ALPHA JP-500 features a rheology capable of standard dispensing or jetting.
This paste is formulated to offer best-in-class in circuit pin test yields and high electrochemical reliability. ALPHA JP-500 offers outstanding reflow process window and solderability across all traditional surface finishes.
The low temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C, and has been successfully used with peak reflow profiles between 155 and 190°C. The flux residue from ALPHA JP-501 is clear and colorless and is formulated to offer high electrical reliability in a zero halogen flux formulation.
ALPHA JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004. All components used with SnBi solders must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.
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