Water-based fluxes

Environmentally friendly (VOC-free)
Thermally very stable activators
Large process window
Extensive prevention of bridging and solder balls
Suitable for leaded and lead-free processes

ALPHA EF-2210-TF

ALPHA EF-2210-TF is a VOC-free, halide-free, and resin-free flux with low solids content. It is one of the highest activity VOC-free fluxes available.

ALPHA EF-2210-TF contains a proprietary blend of organic activators that ensure excellent wetting and reliable top-side hole filling, even on OSP-coated bare copper boards that have been previously subjected to thermal stress. Additionally, the flux contains several proprietary additives that reduce the surface tension between the solder mask and the solder, thereby drastically reducing solder ball formation. The formulation of ALPHA EF-2210-TF is also designed to be thermally stable, thus reducing the occurrence of solder bridges.

Features & benefits of ALPHA EF-2210-TF:

J-STD-004B SIR compliant
VOC-free to comply with environmental regulations
Excellent wetting and excellent hole filling even on OSP-coated bare copper boards with prior reflow
Thermally stable activators ensure low solder bridging
Reduces the surface tension between solder mask and solder, resulting in low solder ball frequency
Suitable for selective soldering processes
Excellent cosmetic properties
Very low level of non-tacky residues, enabling good pin testability
Suitable for leaded and lead-free processes

ALPHA WB-700-TF

ALPHA WB-700-TF is a VOC-free, halogen-free, resin-free, and low-residue no-clean flux with the highest activation among Alpha’s VOC-free fluxes. It is formulated with a proprietary blend of organic activators that provide excellent wetting and good penetration even on passivated copper surfaces after repeated thermal stress. Several proprietary additives reduce the surface tension of solder mask and solder, thus drastically reducing solder ball formation. The ALPHA WB-700-TF formula is characterized by high temperature resistance and significantly reduces the formation of solder bridges and shorts.

Features & Benefits of ALPHA WB-700-TF:

VOC-free, facilitating compliance with emission regulations
Excellent wetting, good penetration, even on passivated copper after multiple reflow processes
Strong reduction of bridges and shorts due to thermally stable activators
Drastic reduction of solder balls by effectively reducing the surface tension on solder masks
Contains extremely low and non-adhesive flux residues – excellent suitability for contact in needle tests
Suitable for lead-free and leaded solders