Solder Paste

Solder pastes for the automatic production process and for manual rework work in SMT assembly production.

Common lead-free and lead-containing alloys, as well as special alloys for high requirements and low melting process temperatures. Very good properties in terms of void behavior and wetting in the soldering process. Flux systems without halogens.

  • Long stencil life
  • Excellent wetting properties
  • Various metal particle sizes
  • Typical SAC alloys
  • Alloys for low-temperature applications
  • Very good workability for lead-containing applications
  • Long stencil service life
  • Very good wetting properties
  • Various metal grain sizes
  • Lead-containing alloys
  • Very good processability
  • Excellent wetting properties
  • Various metal particle sizes
  • Typical SAC alloys
  • Alloys for low-temperature applications
  • Lead and lead-free alloys

Enhances the Environmental Sustainability of the Assembly Process

Low temperature alloys offers a significant reduction in peak reflow temperature over existing SAC reflow conditions. The ability to reliably solder at 175 °C peak temperatures will increase the efficiency of existing assembly processes while lowering the manufacturers net impact on its surrounding environment.