Alpha solder pastes OM-5100 and OM-5300 are specially designed for lead-containing applications – qualified according to ROL0 IPC J-STD 004A.
The solder pastes are available in grain sizes T3 and T4, as well as in the alloys tin-lead (SnPb) and tin-lead-silver (SnPbAg).
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Unsere Spezialisten stehen Ihnen gerne bei Beratungen zu den verschiedenen Fertigungsprozessen oder komplette Linienlösungen zur Seite.
