Solder pastes with lead-containing alloy

  • Very good workability for lead-containing applications
  • Long stencil service life
  • Very good wetting properties
  • Various metal grain sizes
  • Lead-containing alloys
Data sheet OM-5100 Download PDF →
Data sheet OM-5300 Download PDF →

Solder pastes OM-5100 and OM-5300

Alpha solder pastes OM-5100 and OM-5300 are specially designed for lead-containing applications – qualified according to ROL0 IPC J-STD 004A.

The solder pastes are available in grain sizes T3 and T4, as well as in the alloys tin-lead (SnPb) and tin-lead-silver (SnPbAg).

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