Solder Preforms

ALPHA preforms are used in areas ranging from PCB assembly to stand-alone industrial applications and high-end power assemblies. The product range includes rectangles with and without flux, ring shapes, sleeves and special shapes for specific applications.

A comprehensive alloy portfolio, including low-temperature solder, rounds off the program. The use of tape-and-reel packaging facilitates implementation in standard SMT production lines using pick-and-place.

Information on the ALPHA lead-free alloys:

SAC305: Sn 96.5 – AG 3 – Cu 0.5

SAC387: Sn 95.5 – Ag 3.8 – Cu 0.7

INNOLOT: Sn – Ag – Cu – Bi – Sb – Ni

  • Available in many sizes and thicknesses
  • Enables fast pick and place assembly
  • Adhesive-free flux suitable for vacuum placement systems
  • Available in standard alloys, as well as Innolot and lead-containing alloys
  • Tape & reel packaging
  • Selective solder volume expansion to increase solder joint strength
  • Allows 100% hole filling
  • Reduces flux residues for ICT
  • Saves rework and inspection after the reflow process
  • Suitable for low temperatures