ALPHA Accuflux solder preforms

Available in many sizes and thicknesses
Enables fast pick and place assembly
Adhesive-free flux suitable for vacuum placement systems
Available in standard alloys, as well as Innolot and lead-containing alloys
Tape & reel packaging

Product brochure - solder preforms

Product overview

ALPHA Accuflux preforms for power electronics are an ideal solution for applications requiring low voiding in large area solder joints and low flux residues.

The flux application process for ALPHA Accuflux preforms is unique and guarantees that each preform contains the same amount of flux within a precisely defined area. The low weight of flux required for good solder wetting results in a significant reduction in voiding.