CEMCO has added a new product to its range of horizontal wet process equipment. A small vertical electroless plating line for laboratory applications for processing printed circuit boards and small parts. The system shown is a laboratory size line, 6780 mm L x 663 mm W x 920 mm H, for use with permanganate and electroless copper. Although the system is relatively small, it contains most of the features normally found in larger plating lines. A range of systems are available to meet all requirements, including for use with electroless and electrolytic applications. The system shown includes a series of tanks housed in stainless steel frames.
Oscillation speed, vibration, solution temperature and air movement are controlled via a touch screen linked to an Allen-Bradley PLC. There is also the option to manually change the oscillation angle, allowing an increase in solution flow between workpieces. A collar tray is fitted underneath, with drip trays and tray covers available as an option. These systems are designed to allow the greatest possible flexibility within the process. Ranges for production and prototype trial and testing. Specific options can be incorporated as required.
