The reflow soldering process is very complex, as the error patterns are often not directly related to the thermal process, i.e. the actual soldering process. Errors caused by the PCB layout, stencil design or stencil printing usually only become apparent after reflow soldering.
Similar to training module 3, selective soldering, basic knowledge of alloys, flux behavior and soldering powder is a prerequisite for understanding the process.
In connection with profiling, participants are also taught about the influence of the thermal mass of an assembly on the soldering result. The common reflow processes, convection and vapor phases, as well as their limits, are theoretically trained in this context.
For the above reasons, we recommend booking Module 5, Stencil Printing, together with Module 4.
Duration: 2 days
Number of participants: minimum 4, maximum 10 persons.
For groups of 4 or more, we offer exclusive appointments for your company by arrangement.
Costs: € 335.00 per day / participant.
Completion: Certificate after performance test as Qualified Reflow Solder Specialist.
