Soldering Technology

Soldering can justifiably be regarded as the decisive process step in the value chain of electronics production. With the formation of the intermetallic layer, the electronic connection is established and the product “comes to life”. No other process is so dependent on the interaction between man – machine – material – and method.

Sophisticated, intelligent gas circulation
Longer heating zones and effective zone separation
Improved profiling by avoiding cross flows
Homogeneous heat transfer and excellent Delta T
Many years of process experience
Particularly easy to maintain and service

Synchro Series

Synchronous Motion Selective Soldering – The next level in selective soldering

Best in class – throughput per area
Our flagship
High volume and high mix production
With 3 or 5 crucibles
Unlimited PCB length
Replaces wave soldering
Patented process

Integra Series

Ideal for medium and high quantities
Highly flexible
Expandable

Cerno 508.1

Ideal for small and medium quantities
Space-saving due to L-R and R-L barrel
Highly flexible

GT Series

The best soldering system with adjustable temperature in its performance class
Ultimate performance through inductive soldering technology

Rework Hot Air System HCT-910

Versatile, rapidly heating 900 W hot air device for soldering and desoldering applications
Maximum temperature of up to 600°C
Maximum air flow of up to 120 l/min
Digital control of air flow and temperature for enhanced precision
Quick, manual switching between temperature and flow rate during operation
Handpiece with start/stop button and status indicator
Tool-free replacement of nozzles

CV Series

SmartHeat Power-on-Demand Technology
Patented Connection Validation IMC Formation Technology
8” color touchscreen with bold graphics
Communications Port for process traceability data and firmware upgrades
Precise tip temperature display