Soldering Technology

Soldering can justifiably be regarded as the decisive process step in the value chain of electronics production. With the formation of the intermetallic layer, the electronic connection is established and the product “comes to life”. No other process is so dependent on the interaction between man – machine – material – and method.

  • Sophisticated, intelligent gas circulation
  • Longer heating zones and effective zone separation
  • Improved profiling by avoiding cross flows
  • Homogeneous heat transfer and excellent Delta T
  • Many years of process experience
  • Particularly easy to maintain and service

Synchronous Motion Selective Soldering – The next level in selective soldering

  • Best in class – throughput per area
  • Our flagship
  • High volume and high mix production
  • With 3 or 5 crucibles
  • Unlimited PCB length
  • Replaces wave soldering
  • Patented process
  • Ideal for medium and high quantities
  • Highly flexible
  • Expandable
  • Ideal for small and medium quantities
  • Space-saving due to L-R and R-L barrel
  • Highly flexible
  • The best soldering system with adjustable temperature in its performance class
  • Ultimate performance through inductive soldering technology
  • Versatile, rapidly heating 900 W hot air device for soldering and desoldering applications
  • Maximum temperature of up to 600°C
  • Maximum air flow of up to 120 l/min
  • Digital control of air flow and temperature for enhanced precision
  • Quick, manual switching between temperature and flow rate during operation
  • Handpiece with start/stop button and status indicator
  • Tool-free replacement of nozzles
  • SmartHeat Power-on-Demand Technology
  • Patented Connection Validation IMC Formation Technology
  • 8” color touchscreen with bold graphics
  • Communications Port for process traceability data and firmware upgrades
  • Precise tip temperature display